A thermal management system consists of materials designed to remove the heat generated by an electronic device (such as a power transistor or a microprocessor) to the ambient environment in order to ensure the reliable operation of the system.
Saint-Gobain's Thermal Management Solutions
Saint-Gobain realizes that the competitive nature of today’s computer assembly market requires automated mass production techniques. That’s why our thermal management products are designed to provide an effective path for heat dissipation with minimal complication to the manufacturing process. In order to accomplish this objective, Saint-Gobain utilizes over 50 years of tape manufacturing experience to design thermal interfaces with creative materials and quality constructions that will deliver maximum performance.
Maximum Thermal Performance in a Cost-effective Form
Maximum thermal performance of a system is critical to optimize the processing speed and the expected life of modern microprocessors, and becomes even more crucial as the power of microprocessors and the power density of computer assemblies continue to increase. If a microprocessor is insufficiently cooled, it will operate at speeds lower than it is capable of. In addition, when a microprocessor is exposed to elevated temperatures for extended time periods, its operating life will be decreased. Saint-Gobain allows designers to incorporate the necessary thermal interface while keeping their assembly costs to a minimum. This combination can produce a reliable system at a very competitive cost.